Adhesives Magazine

RadTech Announces Technology Expo and Conference Program

February 15, 2012

RadTech recently announced program details for its UV and EB Technology Expo and Conference, which will take place April 30-May 2 in Chicago. A keynote by developers of the world’s lightest structure, ultraviolet (UV) and electron beam (EB) technologies used across the spectrum of U.S. manufacturing will be the focus of the conference.

“The re-emergence of U.S. manufacturing is built on technologies that enable better productivity and products, while keeping processes lean, energy efficient and sustainable,” said Gary Cohen, executive director.

UV and EB technology is on the forefront of high-tech manufacturing and has reportedly enabled thousands of unique manufacturing solutions worldwide in industries such as photovoltaics, consumer packaging, wood, automotive, aerospace, and flexible electronics. Event sessions include: Graphic Arts; Barrier Coatings and Conductive Films for Flexible Electronics; Harsh Environments-Corrosion, Weathering and Exterior; Nanomaterials; LEDs; Rapid Field Applied; and Stereolithography. Representatives from the U.S. Department of Commerce, as part of President Obama’s export initiative, will discuss expanding exporting opportunities; and yet2.com will explain the benefits from open innovation, including case studies on touchscreen/displays, sustainable packaging, and food packaging applications.

For more information, visit www.radtech2012.com.