Adhesives Magazine

TAPPI PLACE Conference Issues Call for Abstracts

May 19, 2011

The 2012 PLACE Conference, which will take place May 7-9, 2012, in Seattle, WA, is seeking technical presentations, panels, tutorials, roundtables, and case studies from the packaging and academic community to be presented at the conference.

The conference will comprise four main topics: New Technology Showcase, Advances in Materials and Equipment, Product Design Innovation, and New Applications & Product End Use. Extended abstracts are due before August 1, and final papers will be due on or before February 21, 2012.

For more information, visit www.tappi.org/12place.