Adhesives Magazine

TAPPI PLACE Issues Call for Papers

September 1, 2011

The 2012 PLACE Program Committee is actively seeking technical presentations, panels, tutorials, roundtables, and case studies from the packaging and academic community to be presented at the conference, which will take place May 7-9 in Seattle, WA.

The PLACE Conference is the premier North American event for the flexible packaging industry and aims to provide something for the whole supply chain, including suppliers, converters, extruders, retailers, and brand owners.

Presentation titles or extended abstracts will be accepted before September 23. Final papers will be due February 21, 2012. For more information, visit www.tappi.org.