Adhesives Magazine

TRA-CON: EPOXY STAKING COMPOUND

October 4, 2004
TRA-BOND 2111 is a thixotropic epoxy designed for industrial adhesive, staking, laminating, repair and manufacturing applications. This two-part adhesive system has a long pot life and is ideal for applications where good wetting, non-sag, non-drip, and improved impact strength properties are essential. TRA-BOND 2111 can be room temperature- or heat-cured, and adheres to most material, including glass and glass fabrics, ceramics, most metals, and many more. TRA-BOND 2111 has excellent mechanical impact and thermal shock resistance characteristics, and also provides resistance to weather, water, gases and vapors, salts, and more. Fully cured TRA-BOND 2111 is a strong, tough and resilient rigid epoxy staking compound ideal for numerous applications.

For more information, visit http://www.tra-con.com or call (800) TRA-CON1.