Adhesives Magazine

Tra-Con: Low Vapor Pressure Epoxy Stacking Compound

October 27, 2003
Tra-Con offers the Tra-Bond 2116, a thixotropic epoxy system, which passes the NASA Outgassing Specification. It is recommended for aerospace, critical electronic and industrial applications. It is a high-fill, no-sag reliable adhesive for enhancing the mechanical and structural rigidity of assemblies and for bonding. The fully cured epoxy provides resistance to weather, galvanic action, petroleum solvents and lubricants, gasoline, jet fuels, alcohol, salts, and mild acids and alkalis. Once cured, it offers a shore D hardness of 90 and an ultimate glass transition temperature of 115 degrees C.

For more information, call 800-TRA-CON1.

http://www.tra-con.com