TRA-CON Offers Thermally Conductive Epoxy Adhesive
February 10, 2004
TRA-BOND 2153 is a low CTE, thermally conductive epoxy adhesive now available from TRA-CON. This product works well on staking transistors, diodes, resistors, integrated circuits and other components to circuit boards. TRA-BOND 2153 readily bonds to most metals, silica, ceramics, glass, plastic and a plethora of other materials. It has excellent electrical insulation capabilities while providing thermal transfer between substrates. The low coefficient of thermal expansion (CTE) makes TRA-BOND 2153 a good match for most materials over a wide temperature range. TRA-BOND 2153 shows exceptional resistance to salt solutions, mild acids, alkalis and other harsh chemicals.
For more information, visit http://www.tra-con.com or call (800) TRA-CON1.