TechFilm Corp. has introduced 12202F, a high-performance, structural B-staged film adhesive capable of developing a 4500 psi bond strength on difficult-to-bond metal substrates such as gold, invar, nickel and engineering and LCP plastics. Partially cured, 100% solid B-staged adhesives are an alternative to liquid adhesives and solders for highly intricate industrial and electronic bonding applications. Available in sheet, preform or roll formats as thin as 1 mil, this film is ideal for applications where size and thinness of the final part is critical. Actual applications include piezoelectric devices, ultrasonic sensors and print heads.
For more information, visit http://www.techfilm.com, call (888) 832-4345 or e-mail email@example.com.