Selective dispensing of fluid onto electronic packages without physical contact in a reliable and consistent manner seems a natural alternative to traditional mass-transfer methods that are often invasive and lack consistency.
Electrically conductive adhesives play an increasingly prominent role in the design and production of electronic packages and assemblies. Continuing improvements in adhesive technology have enabled adhesives to replace solder in some specialized electronic assembly applications.
When it comes to obtaining the desired performance properties of adhesive and sealant formulations, purchasing, modifying or adjusting process equipment is not always economically feasible. This is especially true when you consider the large and ever-growing variety of raw materials available. Therefore, it becomes imperative to properly select the most appropriate raw material to fit the current processing capabilities.
Mixing two-component flexible cementitious sealing slurries on-site immediately before use may soon become a thing of the past. A redispersible polymer powder has been developed that enables the formulation of one-component products. Polymer powders of this type can also be used successfully, in other ‘elastic' applications, such as highly flexible tile adhesives