Silicones used in adhesive and sealant applications can provide good bonding to substrates without the use of primers or surface modification techniques, such as corona, flame and plasma treatments; but some situations require the use of these additional components and/or processing steps to significantly boost adhesion to substrate surfaces.
is the first of two articles addressing the role that low-molecular-weight
polyolefins and wax additives have in the formulation and performance of
hot-melt adhesives. This part examines wax additives available to the
formulator; their composition, characteristics, and manufacture; and general
information about their use. Part two will address specific characteristics of
various types of polyolefins and their role in hot-melt adhesives, including
the globe, agitator mixing, or mechanical agitation, is the most common mixing
technique in the liquid-processing industry. This type of mixing is less
expensive than other methods, offers more portability, is more easily
available, and there are many variations for industry to choose from.
use of adhesive-backed components is steadily growing as a method for
assembling much of today’s technology. Computers, mobile phones and handheld
electronic devices all use adhesive components in numerous instances, including
labels, insulators, shields, and screens. While this trend is improving product
performance, the lack of standardized assembly platforms inhibits the adoption of
adhesive technology and its broad-based acceptance.