DEK has announced that its Eform stencil manufacturing process has taken electroform stencils to the next level by incorporating an exclusive, sophisticated aperture height control method to their production of Eform stencils.
Fusion UV Systems, Inc. has announced plans to conduct live UV inkjet printing demonstrations during the upcoming e|5 2004 RadTech North America Technology Expo & Conference being held May 2-5 at the Charlotte Convention Center in Charlotte, NC.
The CHEMARK Consulting Group has announced its involvement in assisting Chemcraft Holdings, Inc. with its recent acquisition of the Alternative Materials Technology Company from AMT Environmental Products, Inc., of Chico, CA
The National Electronics Manufacturing Initiative (NEMI), an industry-led consortium focused on strengthening the global electronics manufacturing supply chain, will kick off its 2004 roadmap March 24-25
The Packaging Machinery Manufacturers Institute (PMMI) has issued a call for presentations for the Conference at PACK EXPO to be held in conjunction with PACK EXPO International scheduled for Nov. 7-11, 2004, at McCormick Place, Chicago
To improve its ability to efficiently develop and deliver flexible product and service solutions for customers with widely differing business needs, Dow Corning's Pressure Sensitive Industry team has made several staff changes
Adhesives and Sealants Industry (ASI) magazine and The Adhesive and Sealant Council, Inc. (ASC) have announced plans to present a Chinese business seminar on June 15, at BWI airport in Baltimore, MD, at the Embassy Suites hotel.