Asymtek, together with fluid suppliers Dow Corning, Dymax, Emerson & Cuming, Henkel Technologies, Humiseal and Shin-Etsu, will present a two-day conformal coating and microelectronics dispensing seminar on April 27-28 in Westford, MA.
In a strategic move to help customers speed time to market and reduce manufacturing costs, Dow Corning Corp. has launched the External Equipment Provider Alliance with nine leading companies from the electronics assembly and packaging industry.
Professor Deborah Nightingale, PhD. of the MIT Lean Aerospace Initiative will present a keynote presentation, "Transforming the Lean Enterprise Value Stream," on Thursday, May 6, 2004, at 12:00 p.m. as part of the NEPCON East/Electro and Assembly East event.
To meet the growing worldwide demand for high-quality hot melt adhesives, the Coatings & Colorants Business Unit of Degussa AG will increase the production capacity for VESTOPLAST, an amorphous poly-alpha-olefin (APAO).