The company featured technologies and products from the Nordson Electronics Solutions and Nordson Test & Inspection divisions.
November 12, 2021
Nordson Corp. recently announced that it showcased solutions for electronics manufacturing, printed circuit board assembly (PCBA), surface mount technology (SMT), and semiconductor packaging at the NEPCON Asia tradeshow in Shenzhen, China.
Formerly known as Global Adhesives Solutions Labs, 3M Bonding Process Centers connect customers with local 3M experts to help solve problems and optimize processes.
September 24, 2021
3M recently announced that its Industrial Adhesives and Tapes Division is evolving its Bonding Process Centers in St. Paul, Minn.; Neuss, Germany; and Shanghai, China.