Electronic components that contain a die require a path by which excess heat can be removed from the component package. In low-voltage plastic-encapsulated microcircuits, the heat may simply travel by conduction through the die attach and the die paddle for dissipation through the bottom of the package.
The award was given for her leadership role as an officer within Committee A05’s Technical Subcommittee A05.11 on Coated Sheet Specifications.
May 26, 2017
The ChemQuest Group Inc. recently announced that Cynthia A. Gosselin, Ph.D., has been awarded the American Society for Testing and Materials (ASTM) International’s Kenneth J. Boedecker, Jr. Distinguished Service Award.