The company is offering an opportunity for European standards training and certification in North America.
November 27, 2017
The ChemQuest Group Inc. recently announced that, through its exclusive partnership in North America with Fraunhofer IFAM, it will deliver the EWF-European Adhesive Bonder (EAB) course.
Electronic components that contain a die require a path by which excess heat can be removed from the component package. In low-voltage plastic-encapsulated microcircuits, the heat may simply travel by conduction through the die attach and the die paddle for dissipation through the bottom of the package.