Tra-Bond 789-3 is a one-part, ultra-tough adhesive specially designed for microelectronic applications. This product is ideal for both substrate attach and package sealing, and it comes in a variety of colors to suit all application needs. 789-3 exhibits strong adhesion to difficult-to-bond metals, such as gold, silver and copper.

For more information, visit http://www.tra-con.com or call (800) TRACON1.