Zymet has introduced a new reworkable underfill encapsulant, CN-1432, designed for CSP and BGA encapsulation. CSPs and BGAs are not normally encapsulated, however it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations. Removal of defective CSPs and BGAs is easily accomplished by heating the component and the underfill encapsulant to 220 degrees C. Underfill residues are easily scraped or brushed off. CN-1432 has a viscosity of 4500 cps at room temperature, making it very easy to dispense. It is also fast-flowing, capable of a flowing distance of 18 mm (with only a single-side dispense) in as little as 15 seconds. After flow is complete, CN-1432 can be cured in an in-line oven in 5 minutes at 165 degrees C.
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