As the growth in the demand for pressure-sensitive technology is highly reliant on the label, tape, graphic, medical and other specialty laminate markets, and pressure-sensitive solutions continue to move into new areas driven by products and processes, the seminar will focus on trends and developments in both technical specialties and applications in the general, label and tape markets.
With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time.
TRFA members, industry leaders, suppliers, formulators, fabricators, students and academicians are encouraged to attend this important thermoset resin industry event, September 29 - October 1, 2013 at the Hyatt Regency Newport in Newport, Rhode Island.
CHINAADHESIVE is the only professional event, which gathers adhesives, sealants, ink, PSA tape and label products in the world. Started in 1997, having16 years history, it has been the must choice event for adhesive, sealant and ink industry. Our show is the ideal platform for industry communication in technology and business.
SAE International’s 2013 AeroTech Congress & Exhibition announces the keynote speakers and executive panel that will be leading the upcoming event in Montréal, Quebec at the Palais de congrés de Montréal, Sept. 24-26.
You have a product to launch, a brand to refresh, a line to move faster, and safety and efficiency benchmarks to reach—and PACK EXPO Las Vegas has solutions. The world’s largest packaging and processing event in 2013 delivers innovations to advance your business objectives.
Chemspec Asia will provide a unique forum to not only debate today's pressing issues, but more importantly, offer the perfect platform for companies to promote their commercial expertise and to form crucial alliances with like-minded partners who wish to develop the potential of an exciting market.