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Package and container sealing is a key component of today’s complex manufacturing processes. Manufacturers require a system that quickly delivers consistently applied adhesive while fitting into streamlined packaging lines. Many companies turn to hot-melt adhesive delivery systems for their packaging needs.
Primary and secondary structures that comprise modern aircraft are typically combinations of metals and lightweight carbon fiber- or glass fiber-reinforced polymer composites joined using high-performance adhesives.
Demand for active and intelligent packaging in the U.S. is forecast to expand 8% annually to $3.5 billion in 2017, well above total packaging demand growth.
Industrial rollers are used in the manufacturing and processing of almost every material—from paper to coiled steel and plastic packaging to textiles.
From the first recorded use of industrial adhesives during the time of the pharaohs in Egypt until today, our industry has had two consistent driving forces: the changing needs of the industries we serve, and the innovation necessary to meet those needs.
Differential release liners play a critical role in the coated product supply chain and adhesives product development.
The choice of elastomers based on styrene block copolymer (SBC) technology for tapes and labels has traditionally been split between solvent and hot-melt systems.
This spring, suppliers, manufacturers and other tape industry professionals will convene at the Gaylord Opryland Resort and Convention Center in Nashville, Tenn., for the Pressure Sensitive Tape Council (PSTC) Tape Summit 2014.
In the rapidly evolving field of B2B Internet marketing, I have worked with dozens of small- and medium-sized manufacturers and distributors on their strategies for being “found” online by the right people: buyers, engineers and users of their products.
ExxonMobil Chemical Co. has announced plans to build what is reportedly the world’s largest hydrogenated tackifier manufacturing facility at its recently expanded petrochemical complex in Singapore.