Electronic components that contain a die require a path by which excess heat can be removed from the component package. In low-voltage plastic-encapsulated microcircuits, the heat may simply travel by conduction through the die attach and the die paddle for dissipation through the bottom of the package.
Next-generation silicone adhesive technologies are key to growth in the wearables market.
June 1, 2017
According to Grand View Research, the global market for wearable medical devices is expected to reach $27.8 billion by 2022.1 Dow Corning reportedly sees the role of specialized adhesive technologies as a key driver of this growth, especially in skin- adhered medical devices, a major segment of the wearables market.
The European Coatings Show returns to Nuremberg, Germany, to explore adhesives, sealants, coatings, inks and construction chemicals.
March 1, 2017
From April 3-6, exhibitors, industry members and experts will travel to Nuremberg, Germany, to attend the European Coatings Show (ECS). The event will feature seven exhibition halls, multiple conference sessions, a keynote speaker, and two networking events.
A new reworkable edgebond adhesive enhances board-level reliability of large WLCSP.
February 1, 2017
A new reworkable edgebond adhesive* from Zymet has been shown to enhance the board-level reliability of a large wafer-level chip-scale package (WLCSP). The work was performed in a collaborative effort between Portland State University, Cisco, and Zymet, and published in the Proceedings of the SMTA International 2016 conference, which took place in Rosemont, Ill.
The use of electronic adhesives in PCBs continues to grow.
February 1, 2017
The global electronic adhesives market is expected to grow at a compound annual growth rate (CAGR) of close to 10% from 2017-2021, according “Global Electronic Adhesives Market 2017-2021,” a recent report from Technavio.