Bostik Extends Born2Bond Portfolio of Engineering Adhesives
Bostik announced it has extended its Born2Bond™ engineering adhesive HMPUR and UV-CIPG ranges. The adhesives are designed to support the manufacture of smaller, more lightweight and increasingly complex consumer electronic devices that are also required to be recyclable and meet all relevant sustainability and safety regulations.
Six new products have been added to Born2Bond's high-performance HMPUR (Hot Melt Polyurethane Reactive) range to deliver precision, durability, and speed of application. The range is flexible and elastic, delivers high bonding strength on multiple substrates, including plastic, glass and metal, and is available in multiple viscosities.