EC-1015HP epoxy potting compound from epoxySet Inc. is a heat-cure system designed for temperature cycling from -55 to 180 °C with significantly better crack resistance than traditional rigid epoxies. As a low viscosity encapsulant, it is used for large and small potting applications with fragile components. The low CTE of 34 ppm/°C also keeps the stresses to a minimum. It offers superior bond strength to most substrates as well as very high chemical and moisture resistance.
EC-1015HP has a high thermal conductivity of 1.2W/m°K with a glass transition temperature of 162 °C. It is an ideal choice for protection of electrical components with a volume resistivity of 10*16 ohm-cm and a dielectric strength of 450V/ml.
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