The TAPPI three-day conference featured several concurrent sessions in the technical program, covering topics including hot melts (both formulation and application), new developments in film, equipment, pretreatment, and resins, among others.
This August, I had the opportunity to attend the 2003 TAPPI PLACE Conference and Global Hot Melt Symposium at the Rosen Center Hotel in Orlando, FL. While Orlando might not be at the top of your destination list for August, if you are involved with the packaging, converting and hot melt industries, then TAPPI certainly should be. The three-day conference featured several concurrent sessions in the technical program, covering topics including hot melts (both formulation and application), new developments in film, equipment, pretreatment, and resins, among others. The sessions were well attended, and lively discussions took place during the question-and-answer sessions and each of the breaks.
The Hot Melts New Technology Showcase featured presentations from several companies on new and innovative technologies that they have created. These included a hybrid hot-melt adhesive from Liquid Polymer Co.; oligomers from Sartomer for formulating UV/EB adhesives; polyols, polyurethane dispersions and non-migratory surfactants from Uniqema; and polyols, antioxidants and antimicrobials for hot melts from Ciba.