Light-Curing Adhesives And Equipment For Faster Assembly And Lower Processing Cost
The challenge now is to choose the best and most cost-effective system for a particular application with today’s large array of light-curing resin and equipment offerings. A simple, four-step evaluation process can indicate the right direction.
On the other hand, for most high-strength bonding, coating, tacking and potting applications requiring depths of cure from 0.003 to 0.250 inches, moderate- or high-intensity lamps with broad-spectrum curing capability, with concentrations in the long-wave and visible spectrum, are most suitable. Cure speeds with these resins and lamps are far slower than for the typical ink or coating application. However, the 1- to 15-feet-per-minute process rates, or 1- to 30-second exposure times, needed to achieve cures are generally far faster than those offered by other resins and fastening alternatives.
Because resin formulations vary significantly in their cured properties and curing characteristics, the process for selecting the adhesive and equipment is crucial. As shown in Table 4 (page 32), there is quite a range of curing capabilities within the universe of light-curing adhesives. The table represents only typical values for some products. It does not include the rates for slower-curing UV cationic epoxies or UV silicones.