Low-Pressure Injection Molding With Polyamide Hot Melts Offers Key Advantages in Electrical- and Electronic-Component Manufacturing
Low-pressure molding is bringing injection-molding capability to applications previously unserved due to either cost or processing challenges. The low-pressure injection-molding process utilizes polyamide resins to allow low-pressure filling of molds. The combination of the process and material offers many benefits to manufacturing costs and finished product performance. Injection molding is no longer cost prohibitive or inflexible to product changeovers. And, sensitive electronic components can now experience the protection and security offered by over-molding.
However, starting or retooling an injection-molding process is typically an expensive endeavor. In addition to the expense of the actual injection-molding equipment, including heavy presses, there is the cost of extensive water-cooling systems and fabrication of costly steel molds.