A new hot-melt glue conveying system improves material-handling efficiency by reducing maintenance costs and downtime.
The patented, custom-engineered system can transport solid hot-melt glue in either pellet (BBs) or chiclet-sized chipform a distance of more than 100 feet from a bulk source to a melter unit. It feeds either one or multiple glue stations, all of which receive material from the same container of adhesives.