The enabling factor for adhesive printing is that aperture diameter controls deposit height. To produce glue dots with heights of 75mm to 1 mm, apertures of different sizes are machined into a single stencil. In a 1-mm-thick stencil, apertures of 0.6, 0.8 and 1.0 mm in diameter produce dots for small 0603, 0805 and 1206 components. For larger components, two to three apertures of 1.5 to 2 mm diameter each produce dots for SOICs, and five apertures of 2 mm diameter each produce dots for QFPs.