Sourcing and selection considerations for board level assembly adhesives
The latest products added to the electronics group of Henkel's SMA range are Chipbonder 3621, for high-temperature and high-humidity conditions, and Chipbonder 3627, which offers rheology specifically designed for high-speed printing and dispensing. Low-temperature-cure adhesives such as Chipbonder 3619 were originally developed for high-speed dispensing onto temperature-sensitive components, but another consideration has boosted its popularity: energy conservation. With new legislation imposing additional taxation burdens on corporate energy users, manufacturers are choosing products that best enable them to reduce curing oven temperatures. Given its cost-saving properties, the Chipbonder line effectively pays for itself.