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In either case, the assembled substrates are usually run through a heated nip-roller to optimize the bond and speed up the curing. Water-based wet-bond adhesives require one of the substrates to be porous to allow removal of the solvent or water, so they are not suitable for your particular application. Some newer liquid adhesives are 100% solids, i.e., they contain no solvents, but some problems still remain in ensuring that the systems do not contain residual monomers, which might contaminate the food.