This website requires certain cookies to work and uses other cookies to help you have the best experience. By visiting this website, certain cookies have already been set, which you may delete and block. By closing this message or continuing to use our site, you agree to the use of cookies. Visit our updated privacy and cookie policy to learn more.
This Website Uses Cookies By closing this message or continuing to use our site, you agree to our cookie policy. Learn MoreThis website requires certain cookies to work and uses other cookies to help you have the best experience. By visiting this website, certain cookies have already been set, which you may delete and block. By closing this message or continuing to use our site, you agree to the use of cookies. Visit our updated privacy and cookie policy to learn more.
Home » MASTER BOND INTRODUCES NEW THERMALLY CONDUCTIVE ADHESIVE
Master Bond EP21AO is a two-component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume. Developed by Master Bond Inc., Hackensack, NJ, this compound is extremely versatile and will adhere well to a variety of similar and dissimilar substrates. It has a low coefficient of expansion, low shrinkage and superb dimensional stability. It also exhibits superior durability and chemical resistance. EP21AO is easy to apply and is a self-leveling paste. It is 100 percent reactive and does not contain any solvents or volatiles. It has a thermal conductivity of 10BTU/in/ft2/hr/0F and a dielectric strength of >400 volts/mil. Its volume resistivity is >1093 ohm cm. EP21AO has a shore D hardness of >85 and a tensile strength of 5,000 psi. Service operating temperature range is -600F to +2500F. EP21AO is available for use in pint, quart, gallon and 5-gallon container kits.