This article discusses the impact of implementing a Pb-free manufacturing process.

The solution is low-pressure molding. LPM is the most economic and effective way to protect printed circuit boards in environments that range from the benign to the very hostile. Today's polyamide hot melts have a greater range of operating temperatures, have greater chemical resistance and offer adhesion to a greater number of substrates than ever before. The cost of these materials is inexpensive per part when compared to two-part mixed liquids, and the risk of failure due to off-ratio mixing or unmixed material is eliminated. This technology eliminates the need for long cure times and cure ovens, for batch processing, and the need to put finished assemblies in a housing that requires either chemical or mechanical fasteners to assemble. It gives manufacturers the flexibility to eliminate tens- if not hundreds- of feet from their assembly lines with the removal of in-line cure ovens and packaging stations. Simply put, this material becomes a housing and environmental barrier.