Thermal paste helps minimize overheating in electronic devices
Created by Deborah D.L. Chung, Niagara Mohawk Professor of Materials Research in the UB School of Engineering and Applied Sciences, the paste, when applied between a heat sink and a heat source, can greatly improve the conduction of heat from the heat source to the heat sink. Heat sinks are widely used in electronics to draw away heat produced by the device and prevent the device from overheating.