With the miniturization of packaging in areas such as electronics, medical devices and wafer fabrication, spatially controlled, precise-deposition of adhesives or adhesive-like materials into increasingly smaller spaces has become critically important.
With the miniaturization of packaging in areas such as electronics, medical devices and wafer fabrication, spatially controlled, precise deposition of adhesives or adhesive-like materials into increasingly smaller spaces has become critically important. Ultraviolet- and electron beam-cured coatings, inks, and adhesives are essential materials for these advanced devices,1 and the need for higher-level packaging to increase board density and complexity also requires adhesive-specific technical advances.2
FUJIFILM Dimatix, a leading provider of commercial and industrial ink jet products, has developed a microdeposition ink jet technology that addresses this market demand for enhancing adhesive processes through non-contact patterned deposition. This past April, the company announced that its cartridge-based Dimatix Materials Printer (DMP) had been used to ink jet spatially controlled patterns of micron-sized adhesive drops. By printing such small and aligned drops, the ability to apply surface mount adhesives in tight junctions becomes both tractable and easy.