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Home » ELECTRONICS/ELECTRICAL ENDUSER: How to Develop and Measure a Uniform and Repeatable Spray Fluxing Process for Lead-Free Wave Soldering

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ELECTRONICS/ELECTRICAL ENDUSER: How to Develop and Measure a Uniform and Repeatable Spray Fluxing Process for Lead-Free Wave Soldering

July 1, 2006
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Ultrasonic Systems Inc. (USI) teams up with a major EMS company to evaluate USI's Performa fluxing system for lead-free wave soldering.

In the ideal no-clean soldering process, the flux applied to the board is consumed in the soldering process, virtually eliminating post-soldering flux residue. If too much flux is applied, excess post-soldering flux residue will be the result. Thus, it is crucial to apply only the amount of flux required to facilitate soldering. To do this properly, a spray fluxing system must apply the flux uniformly to the bottom surface of the circuit board and into the through holes. In order to maintain this process throughout a production shift, the spray-fluxing system must have the capability of repeating the preset flux deposition amount with very little variation.

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