This website requires certain cookies to work and uses other cookies to help you have the best experience. By visiting this website, certain cookies have already been set, which you may delete and block. By closing this message or continuing to use our site, you agree to the use of cookies. Visit our updated privacy and cookie policy to learn more.
This Website Uses Cookies By closing this message or continuing to use our site, you agree to our cookie policy. Learn MoreThis website requires certain cookies to work and uses other cookies to help you have the best experience. By visiting this website, certain cookies have already been set, which you may delete and block. By closing this message or continuing to use our site, you agree to the use of cookies. Visit our updated privacy and cookie policy to learn more.
Home » ELECTRONICS/ELECTRICAL ENDUSER: How to Develop and Measure a Uniform and Repeatable Spray Fluxing Process for Lead-Free Wave Soldering
Ultrasonic Systems Inc. (USI) teams up with a major EMS company to evaluate USI's Performa fluxing system for lead-free wave soldering.
In the ideal no-clean soldering process, the flux applied to the board is consumed in the soldering process, virtually eliminating post-soldering flux residue. If too much flux is applied, excess post-soldering flux residue will be the result. Thus, it is crucial to apply only the amount of flux required to facilitate soldering. To do this properly, a spray fluxing system must apply the flux uniformly to the bottom surface of the circuit board and into the through holes. In order to maintain this process throughout a production shift, the spray-fluxing system must have the capability of repeating the preset flux deposition amount with very little variation.