ELECTRONICS/ELECTRICAL ENDUSER: Hot Designs Need a Stronger Bond
Heat-activated film solves the problems of traditional bonding in electronics applications.
Using HAF, however, presents another set of challenges: it is a rather elastic material, has no tack when cold, and needs temperatures of up to 220°C for a certain time to bond. This requires a placement mechanism that can handle fragile, non-tacky materials while offering the ability to program time, temperature, and pressure to control the bonding process.