Cure time for thermically active adhesives can be accelerated by using infrared spot curing.
ince the early days of the microelectronics industry, adhesives have been used for simple applications such as wire tacking to replace mechanical tie-downs, as well as more complex applications such as mechanical elements of multichip modules (MCM), as underfills for BGAs or LGAs, as electrically or thermally conductive components of printed circuit board assemblies, and as the interface connection between optical and electrical networks for fiber-to-the-home (FTTH) applications. Adhesives are versatile in that they can be applied as liquids, pre-applied as films or post-applied as wicking liquids. They can also be formulated to provide a variety of physical properties. Adhesives are formulated with different moduli of elasticity to address structural needs, and they can be made with glass transition temperatures appropriate to differing application requirements.