Using die-attach film at the wafer level compared to using die-attach material on individual die offers many benefits. To completely take advantage of the use of die-attach film at the wafer level, the die-attach film has to be optimized to account for various process conditions that the film has to successfully pass through without degradation in any of its end use properties, including adhesion strength and thermal and electrical properties.
Recently, the demand for handheld devices has led to more advanced technologies in 2.5-D and 3-D packaging, and in the handling of extremely thin wafers and dies. The material supply industry has responded by providing newer generations of die-attach films and wafer protection material to these increasingly demanding challenges. Packaging using wire-bonding, flip-chip soldering or the direct mechanical contact attach from flip-chip to bond pads effectively dictates the choice of different wafer level die-attach solutions.