Reportedly adding functional capability to its award-winning Technomelt® hot-melt encapsulants, this company has developed a thermally conductive Technomelt material. With the ability to transfer heat through the encapsulating layer, the new products offer dual-function performance in a single material solution.
Technomelt materials are reportedly an alternative to multi-step, potting processes. Because the materials can be melted, molded, and cooled quickly under low pressure, they can deliver a encapsulation technique that provides a high throughput solution for protection of delicate circuitry and PCB assemblies, while forming a self-enclosed housing. These advantages are now expanded with the addition of thermal conductivity to enable heat dissipation.