Vacuum Dispensing Helps Users Say Goodbye to Air Bubbles
Vacuum dispensing prevents air from getting caught between a component and coating.
When manufacturing electronic components, it is important to protect the workpieces against future external influences; most manufacturers use potting or filling to do this. Vacuum dispensing is often the method of choice, especially for high-performance applications. While many manufacturers use this highly efficient type of dispensing, others have not tried it because they consider it too complex, or they think the up-front investment is too high.
Automotive, industrial and consumer electronics all comprise electronic components such as chips or entire printed circuit boards (PCBs) that must be protected against mechanical or chemical stress. One typical example are motor control sensors such as exhaust sensors or components that come in contact with hot gearbox oil. Other applications involve unprotected wire coils and the enameled copper wires of wire coiled components. Depending on their usage, any one of these components may be exposed to considerable stress in terms of corrosion, vibrations, moisture or high voltage. Since injection molding is a highly complex production technique and production costs of the molds are considerable, most manufacturers choose potting or filling for their production environment.