This company offers a new SolderPlus® dispensing paste formula to improve bond reliability in radio frequency identification (RFID) tags, dual interface (DI) smart cards, and biometric passports. These applications require attaching an antenna electrically connected to a chip.
The process of applying the solder paste is reported to be faster and easier because there is no curing time required. Also, solder paste can be stored at a higher temperature, requiring less time to thaw.