MASTER BOND INC.: Non-Premixed and Frozen, One-Part Epoxy for Chip Coating
Supreme 3CCM-85 reportedly cures within 2-3 hrs at 175-185°F (80-85°C), which is advantageous for use on heat-sensitive components and substrates.
Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is reportedly a new single-component epoxy initially designed for glob top and chip coating applications. However, according to the company, this system can also be utilized for encapsulation and bonding. Supreme 3CCM-85 reportedly cures within 2-3 hrs at 175-185°F (80-85°C), which is advantageous for use on heat-sensitive components and substrates.
Master Bond reports that Supreme 3CCM-85 is a toughened adhesive system that bonds well to a variety of similar and dissimilar substrates. It has a high volume resistivity of more than 1,014 ohm-cm and a thermal conductivity of 5-10 BTU•in/ft2•hr•°F [0.72-1.44 W/(m•K)]. The system is serviceable from -100 to 350°F (-73 to 177°C).