Henkel Featuring Solutions for High-Reliability Applications at IMAPS 2019
Henkel materials and process personnel are sharing their know-how during several educational sessions throughout the IMAPS event.
Henkel’s presence at the IMAPS symposium, which is taking place September 30-October 3 in Boston, Mass., is reportedly centering on its expertise at the wafer and board level, with particular emphasis on solutions for aerospace electronics. As miniaturization and expanded function are impacting the entire electronics ecosystem—from bare wafers to integrated systems—new materials are required to cope with the effects of increased heat generation, exposure to harsh environments, and smaller package dimensions.
Henkel reports that it has developed a range of advanced formulations to address the challenges of today’s electronic realities. At IMAPS 2019, Henkel team members will deliver presentations on emerging technologies and will be available in the booth 408 to discuss several of the company’s enabling products, including: