EP21TPHT is an electrically insulating material with a dielectric constant of 3.9 and volume resistivity of more than 1,014 ohm-cm at 75˚F.
Master Bond EP21TPHT is a new two-component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds that are resistant to chemicals. According to the company, the adhesive resists temperatures up to 350˚F, much higher than typical epoxy polysulfide systems. The room-temperature-curable adhesive also features convenient handling characteristics with a 1:1 mix ratio by weight or volume and an easily flowable mixed viscosity of 5,000-15,000 cps.
“EP21TPHT offers a high lap shear strength of 1,600-1,800 psi and bonds well to a variety of substrates including metals, composites, glass, ceramics, and many rubbers,” said Rohit Ramnath, senior product engineer. “It is a toughened compound with good elongation of 20-40%, and a relatively low tensile modulus of 30,000-50,000 psi at room temperature. This combination of properties makes it suitable for applications involving thermal cycling and mechanical stresses.”