Could you please suggest an epoxy resin, along with a hardener and accelerator, to use as a raw material in the production of a high-temperature-resistant adhesive?
Dr. Dave provides details regarding the use of inorganic vs. organic adhesives for high-temperature applications.
Question: Could you please suggest an epoxy resin, along with a hardener and accelerator, to use as a raw material in the production of a high-temperature-resistant adhesive? It may be a one- or two-part system. We need temperature resistance up to 500°C, and the adhesive will be applied to fill small gaps in a hot mild steel structure. The required initial setting time is 5 min.
Answer: That temperature is much too high for an epoxy adhesive. You almost certainly require an adhesive based on inorganic materials. In contrast to organic adhesives, where few can perform above 250°C, inorganic adhesives have been developed that offer a service temperature of over 2,000°C. These are based on inorganic binding compounds such as sodium silicates and various metal phosphates, with carbon, alumina, silica, magnesia, or zirconia powder fillers.