Vacuum potting is mainly aimed at electronic components with small openings and complex internal structures.
The potting of electronic components involves filling the assembly with a compound such as liquid resin (e.g., epoxy, silicone, polyurethane) to protect it from environmental or use conditions like moisture, humidity, and vibration. Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component.
Potting under vacuum is therefore frequently required to prevent air entrapment, especially with the increasingly small and complex assemblies required in today’s electronics. Through a dispensing application test in the new laboratories of ViscoTec Asia, a customer request recently highlighted the advantages of potting under vacuum.