According to Henkel, its new liquid TIM effectively marries high thermal conductivity of 7.0 W/mK with a maximum possible speed tested of 18 g per second.
Henkel recently announced the debut of Bergquist gap filler TGF 7000, a thermal interface material (TIM). According to the company, the liquid TIM effectively marries high thermal conductivity of 7.0 W/mK with a maximum possible speed tested of 18 g per second. With excellent throughput capability, the material is well-suited for applications such as automotive ADAS systems, power conversion systems, electric pumps, and ECUs where mass production, reliability, and high thermal conductivity are required for today’s smaller footprint, higher power designs.
“From a chemistry perspective, engineering a liquid TIM with substantive filler content that also allows fast dispensing is an exceptionally difficult balance to achieve,” said Holger Schuh, Henkel global technology expert. “One might expect a liquid material with high thermal conductivity to experience separation, settling, caking and clogging of the dispensing equipment, but Bergquist Gap Filler TGF 7000 exhibits none of these issues.”