Covestro to Present Multiple Technologies During Digital Expo
Applications of technologies featured at the expo include the bonding of upper material to the outsole of shoes and the application of adhesives to smartphone displays.
On September 14-16, Covestro will hold Digital Expo 2021 to highlight its technological offerings in four categories: Mobility, Living, Construction & Infrastructure, and Packaging. One example can be found in the manufacture of casual shoes, sneakers, and sports shoes. When bonding the upper material and the outsole, it is important to ensure exact dosing and precise application at the correct location so that the sole does not come off and visibly excessive application is avoided.
Many of the labor-intensive production steps in this process are still performed manually, however, such as the application of the adhesive with a brush. Covestro reports that hot-melt adhesives based on its Desmomelt® U thermoplastic raw material powder can be applied automatically and in precise doses using digital printing.