Master Bond EP40TC is a two-part epoxy system designed for bonding, sealing, and encapsulating applications where thermal conductivity and electrical insulation are required. With a high thermal conductivity value of 8-11 BTU•in/(ft2 •hr•°F) [1.16-1.60 W/(m•K)], it is formulated with a small particle size filler, making it ideal for filling small cavities and applying the product in thin sections. Its volume resistivity is greater than 1015 ohm-cm.
“EP40TC’s key distinguishing factor is that there is no compromise on the bond strength while providing excellent elongation and toughness,” said Rohit Ramnath, senior product engineer. “It has a high strength profile with a tensile lap shear strength of 2,300-2,500 psi, an elongation of 60-70%, and a tensile modulus of 5,000-15,000 psi. Also, it meets NASA low outgassing specifications which is a prerequisite for many aerospace, electronic, and optical applications.”