HENKEL: Thermal Interface Material for Digital Applications
Henkel recently announced the commercialization of its latest gel thermal interface material (TIM), BERGQUIST® LIQUI FORM TLF 10000. The one-part, high thermal conductivity dispensable gel is designed to provide robust heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.
Larger, higher power devices such as application-specific integrated circuits (ASICs) and field-programmable gate arrays (FPGAs) are the norm in 5G telecom infrastructure gear, data center switches, routers, and servers, as well as electric vehicle (EV) infrastructure and industrial automation electronics. As component density and complexity increase in response to faster data processing and digitalization requirements, higher wattage thermal output must be controlled to deliver dependable performance. According to Henkel, BERGQUIST LIQUI FORM TLF 10000 provides 10.0 W/m-K thermal conductivity and is ideal for applications where environments can be extreme or unpredictable and reliability is critical.