Master Bond EP4G-80Med is a one-part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which reportedly leads to good thermal and electrical conductivity. It possesses a thermal conductivity of 1.44-1.73 W/(m•K) and a volume resistivity of 50-100 ohm-cm. In addition, it complies with the ISO 10993-5 guidelines and is considered to be non-cytotoxic.
The company reports that EP4G-80Med bonds well to a variety of substrates, including metals, glass, ceramics, rubbers, and many plastics. It is effective as an EMI/RFI shielding compound and can also be used for static dissipation purposes. This system does not need high heat to cure; it cures readily in 60-90 min at 80°C. Post curing for 1-2 hrs at 80°C is commonly recommended, as it will optimize the overall properties of the epoxy. The product’s curing profile makes it suitable for many applications involving heat-sensitive substrates.