Toyo-Morton Ltd., a member of the Toyo Ink Group, has developed ECOAD™ EA-B3860/EA-B1290. This high-solids, solvent-based adhesive is available for use in the dry lamination of multilayered films in flexible packaging structures. Containing over 40% coating solids by weight, the new formulations contain less solvent and thus bring down overall CO2 emissions during lamination by roughly 25% when compared to the company’s general-purpose laminating adhesives.
The high-solids design also reportedly leads to less waste recovery and disposal for greater operational efficiencies and a cleaner work environment. Moreover, the new ECOAD systems were formulated with bio-based or renewable content of 10% by weight at the dried adhesive layer, making them a more eco-friendly alternative in packaging materials.